AMG-5000 is AKO’s next-generation 300 mm silicon wafer geometry metrology system,featuring dual-side synchronous interferometric nanometrology. Designed for bare silicon wafers, it delivers sub-nanometer measurement precision and optical resolution over three times that of WS2+, providing a direct evolution path from WS2+ and WS5 platforms. AMG-5000 precisely characterizes thickness distribution, flatness, shape, warp, and nano-topography (NT). Built for high-volume manufacturing (HVM) and IC FAB front-end processes, AMG-5000 maintains high precision and efficiency in production. Supporting advanced technology nodes down to 7 nm, it ensures robust process control and quality assurance, improving wafer and chip yield and stability

APG-5000 is AKO’s next-generation 300 mm silicon wafer metrology system, built on dual-side synchronous interferometric nanometrology.The system delivers optical resolution far beyond PWG5+ with sub-nanometer precision and seamless upgrade compatibility with PWG2+ and PWG5 platforms. Designed for patterned wafers, APG-5000 accurately measures thickness, flatness, shape, and dual-side nano-scale topography.The system provides advanced monitoring of wafer coating, CMP-induced warp, planar stress, higher-order deformation, and in-plane displacement (IPD), while supporting lithography Overlay error prediction and control. Deployed across R&D and HVM IC fabs, before and after wafer bonding and post-thinning, APG-5000 combines high precision with robust throughput to ensure reliable process control, maintain product quality, and maximize wafer and chip yield

AWG-5000 is AKO’s integrated interferometric wafer geometry metrology system, designed for patterned wafers. It enables analysis and characterization of stress and its variation caused by coating, CMP, and wafer bonding, as well as in-plane displacement (IPD) resulting from higher-order deformation, critical for lithography Overlay error assessment. The system features high optical resolution, meeting EE = 1 mm advanced lithography inspection requirements. AWG-5000 supports Warpage, IPD, Stress, and LSC measurements, and accommodates multiple wafer placement modes including Chuck, air-bearing, and horizontal orientation, with 37 um lateral resolution