AP7XP is innovatively designed and manufactured by AKO to deliver performance comparable to the KLA SP7XP. The system features a large field of view (FOV) and high numerical aperture (NA), with a minimum particle detection sensitivity of 12.5 nm and a lateral resolution of 0.7um.  Leveraging a TDI spiral line scan platform (similar to the SP7 configuration) and combining advanced AI withsmart algorithms, AP3 meets the stringent defect inspection requirements of high-volume wafer manufacturing (HVM) and IC FAB particle control,supporting technology nodes from 5 to 7 nm and effectively improving wafer and chip yield

AP5XP is innovatively designed and manufactured by AKO to deliver performance comparable to the KLA SP7XP. The system features a large field of view (FOV) and high numerical aperture (NA), with a minimum particle detection sensitivity of 17 nm and a lateral resolution of 0.7um.  Leveraging a TDI spiral line scan platform (similar to the SP7 configuration) and combining advanced AI withsmart algorithms, AP5XP meets the stringent defect inspection requirements of high-volume wafer manufacturing (HVM) and IC FAB particle control, supporting technology nodes above14 nm and effectively improving wafer and chip yield

AP3 is innovatively designed and manufactured by AKO to deliver performance comparable to the KLA SP3. The system features a large field of view (FOV) and high numerical aperture (NA), with a minimum particle detection sensitivity of 19 nm and a lateral resolution of 1.7um. Leveraging a TDI spiral line scan platform (similar to the SP7 configuration) and combining advanced AI withsmart algorithms, AP3 meets the stringent defect inspection requirements of high-volume wafer manufacturing (HVM) and IC FAB particle control, supporting technology nodes above 28 nm and effectively improving wafer and chip yield