SPI-300
Wafer Surface Profile Inspection and Sorting System
SPI300 is developed based on spectral confocal technology, focuses on the measurement and sorting of key form parameters (THICKNESS, TTV, BOW, WARP, LTV) for compound semiconductors and bonded wafers
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Focused on compound semiconductors & bonded wafers
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Wide applicability & high cost-effectiveness
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Delivers high-precision, high-throughput wafer geometry measurement
